Tianbo Liu is an architectural designer as well as a recent graduate of Master of Architecture at University of Michigan.
Tianbo Liu has 5-year B. Arch (Bachelor of Architecture) education in Shanghai Jiaotong University, one of the most distinguished universities in China and graduated with honor, College Graduate Excellence Award. Tianbo is proficient with AutoCAD, Revit, Rhino, SketchUp, Grasshopper and rendering programs. In March 2016 and November 2015, he was invited to run the Rendering Workflow Workshops at Taubman College, University of Michigan to help others with rendering programs like Vray and Artlantis as well as advanced Photoshop illustration on architectural representation.
While working in China previously, he got exposed to the whole process of practical architectural projects from SD Phase to CD Phase, which gave him a deeper understanding in architectural design, materials, structure, and systems. His solid academic background, coupled with relevant work experience has given him the confidence, tools and abilities necessary to achieve further success in his future career.
Cook Architectural Design Studio, Chicago, IL, US, Architectural Intern
One-week internship organized by Taubman College, University of Michigan
Tasks: project rendering, interior design with Revit, graphic design.
Dalian Institute of Urban and Architecture Design, Dalian, Liaoning, CN, Architectural Intern
Conceptual, initial & construction design of housing and mix-used commerce
Dalian Jianfa Institute of Architectural Design, Dalian, Liaoning, CN, Architectural Intern
Conceptual, initial design of housing
Final presentation documentation
Dalian Jianfa Institute of Architectural Design, Dalian, Liaoning, CN, Architectural Intern
Conceptual, initial design of housing, museum and landscape
Final presentation documentation
Shanghai Jiaotong University, Shanghai, China, Minhang Campus, Shanghai, BArch, 5-year Bachelor of Architecture
Graduation with honor: College Graduate Excellence Award, Award
Issuer: Shanghai Jiaotong University (SJTU)
SJTU Scholarship A, Scholarship
Issuer: Shanghai Jiaotong University (SJTU)
Shanghai Pocket Square Design Competition, 2nd Place
Issuer: Shanghai Urban Planning & Design Institute
SJTU Structural Design Competition, 3rd Place
Issuer: Shanghai Jiaotong University (SJTU)
SJTU Pavilion Design Competition, 1st Place
Issuer: Shanghai Jiaotong University (SJTU)